AON6526 30v n-channel alphamos general description product summary v ds i d (at v gs =10v) 32a r ds(on) (at v gs =10v) < 7m w r ds(on) (at v gs = 4.5v) < 9m w application 100% uis tested 100% r g tested symbol v ds v gs ? latest trench power alphamos ( mos lv) technology ? very low rds(on) at 4.5v gs ? low gate charge ? high current capability ? rohs and halogen-free compliant ? dc/dc converters in computing, servers, and pol ? isolated dc/dc converters in telecom and industri al 30v v 20 gate-source voltage drain-source voltage 30 v maximum units parameter absolute maximum ratings t a =25c unless otherwise noted g ds top view 12 3 4 87 6 5 pin1 dfn5x6 top view bottom view v gs i dm i as e as v ds spike v spike t j , t stg symbol t 10s steady-state steady-state r q jc avalanche energy l=0.05mh c a t a =25c i dsm a t a =70c i d 32 25 t c =25c t c =100c 110 pulsed drain current c 21 v 20 gate-source voltage maximum junction-to-ambient a c/w r q ja 17 units junction and storage temperature range -55 to 150 c thermal characteristics parameter typ max mj avalanche current c 19 continuous drain current 29 24 a 34 continuous drain current g power dissipation b p d 100ns 36 w t a =70c 3.8 t a =25c 6 v maximum junction-to-case c/w c/w maximum junction-to-ambient a d 3.5 53 5 44 w 25 t c =25c 10 t c =100c power dissipation a p dsm rev0: sep 2011 www.aosmd.com page 1 of 6
AON6526 symbol min typ max units bv dss 30 v v ds =30v, v gs =0v 1 t j =55c 5 i gss 100 na v gs(th) gate threshold voltage 1.2 1.8 2.2 v 5.5 7 t j =125c 7.2 9 7 9 m w g fs 83 s v sd 0.7 1 v i s 30 a c iss 1229 pf c oss 526 pf c rss 83 pf r g 0.8 1.7 2.6 w q g (10v) 24 33 nc q g (4.5v) 12 17 nc q gs 4 nc q gd 5.5 nc t d(on) 7.0 ns t r 4.8 ns t 24.0 ns gate resistance v gs =0v, v ds =0v, f=1mhz total gate charge gate source charge electrical characteristics (t j =25c unless otherwise noted) static parameters parameter conditions i s =1a,v gs =0v i dss m a zero gate voltage drain current drain-source breakdown voltage m w i d =250 m a, v gs =0v v gs =10v, i d =20a gate-body leakage current v ds =v gs, i d =250 m a v ds =0v, v gs = 20v switching parameters turn-on delaytime gate drain charge total gate charge v gs =10v, v ds =15v, i d =20a turn-on rise time turn-off delaytime v gs =10v, v ds =15v, r l =0.75 w , r =3 w forward transconductance v ds =5v, i d =20a dynamic parameters v gs =4.5v, i d =20a r ds(on) static drain-source on-resistance diode forward voltage reverse transfer capacitance v gs =0v, v ds =15v, f=1mhz maximum body-diode continuous current input capacitance output capacitance t d(off) 24.0 ns t f 5.8 ns t rr 12.6 ns q rr 15.2 nc this product has been designed and qualified for th e consumer market. applications or uses as critical components in life support devices or systems are n ot authorized. aos does not assume any liability ar ising out of such applications or uses of its products. aos reserves the right to improve product design, functions and reliability without notice. turn-off fall time body diode reverse recovery charge body diode reverse recovery time i f =20a, di/dt=500a/ m s i f =20a, di/dt=500a/ m s turn-off delaytime r gen =3 w a. the value of r q ja is measured with the device mounted on 1in 2 fr-4 board with 2oz. copper, in a still air environ ment with t a =25 c. the power dissipation p dsm is based on r q ja and the maximum allowed junction temperature of 150 c. the value in any given application depends on the user's specific board design. b. the power dissipation p d is based on t j(max) =150 c, using junction-to-case thermal resistance, and i s more useful in setting the upper dissipation limit for cases where additional heatsi nking is used. c. single pulse width limited by junction temperat ure t j(max) =150 c. d. the r q ja is the sum of the thermal impedance from junction t o case r q jc and case to ambient. e. the static characteristics in figures 1 to 6 are obtained using <300 m s pulses, duty cycle 0.5% max. f. these curves are based on the junction-to-case t hermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of t j(max) =150 c. the soa curve provides a single pulse rating. g. the maximum current rating is package limited. h. these tests are performed with the device mounte d on 1 in 2 fr-4 board with 2oz. copper, in a still air environ ment with t a =25 c. rev0: sep 2011 www.aosmd.com page 2 of 6
AON6526 typical electrical and thermal characteristics 17 52 10 0 18 0 20 40 60 80 100 0 1 2 3 4 5 6 i d (a) v gs (volts) figure 2: transfer characteristics (note e) 0 2 4 6 8 10 0 5 10 15 20 25 30 r ds(on) (m w ww w ) i d (a) figure 3: on-resistance vs. drain current and gate voltage (note e) 0.8 1 1.2 1.4 1.6 0 25 50 75 100 125 150 175 normalized on-resistance temperature (c) figure 4: on-resistance vs. junction temperature (note e) v gs =4.5v i d =20a v gs =10v i d =20a 25 c 125 c v ds =5v v gs =4.5v v gs =10v 0 20 40 60 80 100 0 1 2 3 4 5 i d (a) v ds (volts) fig 1: on-region characteristics (note e) v gs =3v 3.5v 6v 8v 10v 4v 4.5v 40 1.0e-05 1.0e-04 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 0.0 0.2 0.4 0.6 0.8 1.0 1.2 i s (a) v sd (volts) figure 6: body-diode characteristics (note e) 25 c 125 c (note e) 0 3 6 9 12 15 2 4 6 8 10 r ds(on) (m w ww w ) v gs (volts) figure 5: on-resistance vs. gate-source voltage (note e) i d =20a 25 c 125 c rev0: sep 2011 www.aosmd.com page 3 of 6
AON6526 typical electrical and thermal characteristics 0 2 4 6 8 10 0 5 10 15 20 25 v gs (volts) q g (nc) figure 7: gate-charge characteristics 0 200 400 600 800 1000 1200 1400 1600 0 5 10 15 20 25 capacitance (pf) v ds (volts) figure 8: capacitance characteristics c iss 0 40 80 120 160 200 0.0001 0.001 0.01 0.1 1 10 power (w) pulse width (s) figure 10: single pulse power rating junction-to-ca se c oss c rss v ds =15v i d =20a t j(max) =150 c t c =25 c 10 m s 0.0 0.1 1.0 10.0 100.0 1000.0 0.01 0.1 1 10 100 i d (amps) v ds (volts) figure 9: maximum forward biased safe 10 m s 10ms 1ms dc r ds(on) t j(max) =150 c t c =25 c 100 m s (note f) 0.01 0.1 1 10 0.00001 0.0001 0.001 0.01 0.1 1 10 100 z q qq q jc normalized transient thermal resistance pulse width (s) figure 11: normalized maximum transient thermal imp edance (note f) single pulse d=t on /t t j,pk =t c +p dm .z q jc .r q jc t on t p d in descending order d=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse operating area (note f) r q jc =5 c/w rev0: sep 2011 www.aosmd.com page 4 of 6
AON6526 typical electrical and thermal characteristics 0 10 20 30 0 25 50 75 100 125 150 power dissipation (w) t case ( c) figure 12: power de-rating (note f) 0 10 20 30 40 0 25 50 75 100 125 150 current rating i d (a) t case ( c) figure 13: current de-rating (note f) 1 10 100 1000 10000 0.00001 0.001 0.1 10 1000 power (w) pulse width (s) figure 14: single pulse power rating junction-to- ambient (note h) t a =25 c 40 0.001 0.01 0.1 1 10 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 z q qq q ja normalized transient thermal resistance pulse width (s) figure 15: normalized maximum transient thermal imp edance (note h) single pulse d=t on /t t j,pk =t a +p dm .z q ja .r q ja t on t p d in descending order d=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse ambient (note h) r q ja =53 c/w rev0: sep 2011 www.aosmd.com page 5 of 6
AON6526 - + vdc ig vds dut - + vdc vgs vgs 10v qg qgs qgd charge gate charge test circuit & waveform - + vdc dut vdd vgs vds vgs rl rg vgs vds 10% 90% resistive switching test circuit & waveforms t t r d(on) t on t d(off) t f t off id + l vds bv unclamped inductive switching (uis) test circuit & waveforms vds dss 2 e = 1/2 li ar ar vdd vgs vgs rg dut - + vdc vgs id vgs i ig vgs - + vdc dut l vgs vds isd isd diode recovery test circuit & waveforms vds - vds + i f ar di/dt i rm rr vdd vdd q = - idt t rr rev0: sep 2011 www.aosmd.com page 6 of 6
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